Chemical Bonding
نویسنده
چکیده
منابع مشابه
Ab Initio Quantum Chemical Studies of 15N and 13C NMR Shielding Tensors in Serine and Complexes of Serine- nH2O: Investigation on Strength of the CαH…O Hydrogen bonding in the Amino Acid Residue.
In this paper, the hydrogen bonding (HB) effects on the NMR chemical shifts of selected atoms in serineand serine-nH2O complexes (from one to ten water molecules) have been investigated with quantummechanical calculations of the 15N and 13C tensors. Interaction with water molecules causes importantchanges in geometry and electronic structure of serine.For the compound studied, the most importan...
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Two bonding models i.e cumullenic and acetylenic models have been proposed to account for thebonding patterns in linear carbon clusters while the bonding patterns in cyclic and 3D geometrieS of theseclusters have remained ambiguous.This work presents the bonding patterns in various C4 and C5 pure clusters at MP2/aug-cc-pVTZ level oftheory. This subject is studied in the light of modern bonding ...
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Almost all direct wafer bonding has been conducted between chemical-mechanically polished substrates or between thin films that were present on top of the polished substrates. Introducing chemical mechanical polishing in the wafer bonding will make a large range of materials suitable for direct wafer bonding, which has found and will find more, applications in integrated circuits, integrated op...
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The chemical stabilization of labile fulleropyrrolidine N-oxides is achieved by encapsulation through intrarotaxane hydrogen bonding.
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A technique to automatically validate the chemical bonding between the atoms during the structure construction on a computer screen using a chemical structure editor is developed. The technique involves the capturing of semantics of the electronLinks between the atoms involved in chemical bonding. An artificial intelligence component is developed to support the system to bring the decisions of ...
متن کاملFusion bonding of rough surfaces with polishing technique for silicon micromachining
Surface roughness is one of the crucial factors in silicon fusion bonding. Due to the enhanced surface roughness, it is almost impossible to bond wafers after KOH etching. This also applies when wafers are heavily doped, have a thick LPCVD silicon nitride layer on top or have a LPCVD polysilicon layer of poor quality. It has been demonstrated that these wafers bond spontaneously after a very br...
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